Six product families covering every layer of data centre thermal management — from chip-level cold plates to room-level integrated chillers, UPS and power distribution.
Model BB-5H5F280. 100% sensible heat ratio. 1kW rated power. AC 220V 50Hz. 85kg.
Medium-density rack cooling. Online hot-swap. Tool-free door removal. Compatible with standard 19" racks.
High-density storage and network room cooling. Parallel-flow heat exchanger. Low water-side pressure drop.
AI inference rack cooling. Handles mixed CPU/GPU rack configurations. Dual-circuit inlet manifold.
High-power GPU cluster cooling. Stainless steel headers. Brazed aluminium core. IP54 rated.
Maximum-density backplane solution. Supports next-generation AI accelerator racks up to 40kW per cabinet.
Reference specification (5kW model):
| Model | Cooling Capacity | Sensible Heat Ratio | Rated Power | Supply | Weight |
|---|---|---|---|---|---|
| BB-5H5F280 | 5kW | 100% | 1kW | AC 220V 50Hz | 85kg |
Dual-pump 1+1 redundant CDU. Integrates pump, cooler, valves, sensors, controllers and piping in a single 2U chassis. 10–60kW.
100–500kW integrated chiller for high-density deployments. Provides supplemental cooling in summer months. N+Y chiller redundancy.
Outdoor adiabatic dry cooler. Uses ambient air for free cooling when outdoor temperature permits. Eliminates compressor use for most of the year.
Precision flow control unit providing stable coolant pressure and flow rate to backplane HX assemblies. Automatic flow balancing.
Aerospace-grade copper cold plate. 0.5mm microchannel geometry. Handles up to 1500W per chip. ±1.5°C temperature uniformity.
Dedicated CDU for chip-level two-phase cooling. Boiling point adjustable 25–85°C via pump pressure. Dual pump 1+1 redundancy.
Distributes and regulates coolant flow and pressure to multiple cold plate assemblies. Modular design for flexible rack configurations.
Zero-transfer-time online UPS. Scalable capacity. Double-conversion topology ensures clean, uninterrupted power regardless of utility quality.
Rack-mounted PDU with per-outlet metering. Remote switching, overcurrent protection, and real-time energy monitoring via web interface.
Pre-integrated computing and cooling infrastructure on a single skid. Factory-tested and pre-commissioned for rapid site deployment.
Hot exhaust air (30–45°C) from servers flows into the rear-door liquid-cooled heat exchanger, transferring heat to the coolant circuit.
Air exits the HX at near-room temperature and recirculates. No air conditioning is needed for the heat load carried by the liquid loop.
Except during peak summer heat, the warm coolant is rejected directly to outdoor dry coolers — no chiller, no compressor, no refrigerant.
In hot weather, the integrated chiller provides supplemental cooling capacity — automatically staged on and off by the building management system.
Tell us your rack power density and we'll specify the right combination of heat exchangers, CDUs and chillers for your facility.
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