As single-chip power rises from 300W to 1500W, only liquid cooling can keep pace. Three proven technology tiers — backplane, cold plate, and dual-loop — matched to every deployment scenario.
Chip and cabinet power densities have grown 5× in less than a decade. Air cooling is fundamentally unable to serve chips above 500W or cabinets above 15kW — liquid cooling is no longer optional.
Liquid-cooled rear-door heat exchangers mounted directly behind server racks. No modification to existing servers required. Ideal for retrofitting existing infrastructure.
Copper cold plates mounted directly to CPUs and GPUs. Phase-change fluid boiling point is dynamically adjusted by pump pressure — achieving ±1.5°C chip temperature control.
Combines chip-level cold plates with a facility-side chilled water loop. Achieves the highest energy efficiency by eliminating compressor-based cooling entirely in most climates.
Aerospace-grade copper cold plates with precision microchannel geometry. Handles up to 1500W per chip. Drop-in compatible with standard GPU and CPU form factors.
Dual-pump cooling distribution unit with 10–60kW capacity. Integrated sensors, controllers, valves and piping in a single rack-mountable chassis.
Outdoor dry cooler with dual-pump configuration. Handles up to 10kW. Uses ambient air for heat rejection — no compressor required when outdoor temperature permits.
10–40kW rear-door heat exchanger. Server-agnostic — works with any existing rack hardware. Supports online maintenance without server shutdown.
100–400kW capacity cooling distribution unit for backplane-level deployments. Dual-pump M+1 redundancy. Scales to full data centre row deployment.
100–500kW chiller unit for high-density backplane deployments. Provides supplemental cooling capacity in summer or high ambient temperature conditions.
| Room Type | Cabinet Power Density | Target PUE | Recommended Solution |
|---|---|---|---|
| AI / Computing Power Room | 25–60kW | 1.15–1.25 | Cold Plate + CDU |
| Storage Room | 15–30kW | 1.20–1.25 | Backplane HX + Rack CDU |
| Network Room | 15–25kW | 1.20–1.25 | Backplane HX + Dry Cooler |
Scalable liquid cooling infrastructure for hyperscale cloud operators managing petabyte-scale workloads.
Purpose-built for AI training and inference. Handles the latest GPU clusters requiring 40kW+ per cabinet.
Extreme density cooling for national-scale HPC installations. Dual-loop architecture achieves PUE <1.10 at scale.
Our thermal engineers will design a liquid cooling system matched precisely to your compute density and site conditions.
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